Patent Assignment
Reel/Frame 019977/0017
Assignment of Assignor's Interest
Recorded: 2007-10-17
Pages: 4
Assignors
CHEN, CHIH-HUA
Executed: 2007-10-11
CHEN, CHEN-SHIEN
Executed: 2007-10-11
KUO, CHEN-CHENG
Executed: 2007-10-11
HSU, KUO-CHING "STEVEN"
Executed: 2007-10-11
CHING, KAI-MING
Executed: 2007-10-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Through-Silicon Vias and Methods for Forming the Same