Patent Assignment
Reel/Frame 020003/0869
Assignment of Assignor's Interest
Recorded: 2007-10-24
Pages: 4
Assignors
LEE, KYO-YEOL
Executed: 2007-10-18
LEE, HWA-SUN
Executed: 2007-10-18
LIM, SEUNG-MO
Executed: 2007-10-18
LEE, TAE-KYUNG
Executed: 2007-10-18
CHUNG, JAE-WOO
Executed: 2007-10-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Forming High-Density Thick Piezoelectric Layer and Piezoelectric Device Including High-Density Thick Piezoelectric Layer Formed Using the Method
Application:
11/877,717 →
Publication:
US 2008/0122319
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.