Patent Assignment
Reel/Frame 020011/0026
Assignment of Assignor's Interest
Recorded: 2007-10-25
Pages: 3
Assignor
LEE, JIN-YUAN
Executed: 2007-10-20
Assignee
MEGICA CORPORATION
ROOM 301/302, NO. 47, PARK 2ND RD.,, HSINCHU, 300, TAIWAN
Covered Property
(1)
Structure of High Performance Combo Chip and Processing Method
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 16, 2009
From: LIN, MOU-SHIUNG
To: MEGICA CORPORATION
Reel/Frame 022396/0247 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →