IP Library › Assignment 022396/0247
Patent Assignment
Reel/Frame 022396/0247

Assignment of Assignor's Interest

Recorded: 2009-03-16 Pages: 5
Assignor
LIN, MOU-SHIUNG
Executed: 2009-03-16
Assignee
MEGICA CORPORATION
ROOM 301/302, NO. 47, PARK 2ND RD.,, HSINCHU, 300, TAIWAN
Covered Properties (2)
Structure of High Performance Combo Chip and Processing Method
Patent: 7,960,212 →
Application: 11/842,957 →
Publication: US 2008/0070345
Structure of High Performance Combo Chip and Processing Method
Patent: 8,124,446 →
Application: 11/842,958 →
Publication: US 2008/0070346
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 25, 2007
From: LEE, JIN-YUAN
To: MEGICA CORPORATION
Reel/Frame 020011/0023 →
Assignment of Assignor's Interest Oct 25, 2007
From: LEE, JIN-YUAN
To: MEGICA CORPORATION
Reel/Frame 020011/0026 →
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →