Patent Assignment
Reel/Frame 020011/0040
Assignment of Assignor's Interest
Recorded: 2007-10-25
Pages: 3
Assignee
MEGICA CORPORATION
ROOM 301/302, NO. 47, PARK 2ND RD.,, HSINCHU, 300, TAIWAN
Covered Property
(1)
Post passivation interconnection schemes on top of IC chip
Application:
11/854,559 →
Publication:
US 2008/0067694
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.