IP Library Assignment 020021/0570
Patent Assignment
Reel/Frame 020021/0570

Assignment of Assignor's Interest

Recorded: 2007-10-26 Pages: 4
Assignors
KANG, EUN JEONG
Executed: 2007-10-10
KIM, GI CHERL
Executed: 2007-10-10
CHANG, MOON HWAN
Executed: 2007-10-07
JEON, EUN CHAE
Executed: 2007-10-10
LEE, YOUNG KEUN
Executed: 2007-10-10
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, KOREA, REPUBLIC OF
Covered Property (1)
Method for Manufacturing Light Emitting Diode Chip and Light Emitting Diode Light Source Module
Patent: 8,114,689 →
Application: 11/924,927 →
Publication: US 2008/0102541
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 17, 2012
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 029045/0860 →