Patent Assignment
Reel/Frame 020028/0215
Assignment of Assignor's Interest
Recorded: 2007-10-29
Pages: 3
Assignee
NXP B.V.
HIGH TECH CAMPUS 60, EINDHOVEN, 5656 AG, NETHERLANDS
Covered Property
(1)
Integrated Circuit Assembly with Passive Integration Substrate for Power and Ground Line Routing on Top of an Integrated Circuit Chip
Related Assignments
(15)
Other recorded transfers of the patent in this record — the chain of ownership.
Deed of Transfer
Apr 6, 2012
From: NXP B.V.
To: ST WIRELESS SA
Reel/Frame 028004/0409 →
Change of Name
Apr 9, 2012
From: ST WIRELESS SA
To: ST-ERICSSON SA
Reel/Frame 028015/0271 →
Status Change-Entity in Liquidation
Feb 2, 2016
From: ST-ERICSSON SA
To: ST-ERICSSON SA, EN LIQUIDATION
Reel/Frame 037739/0493 →
Security Agreement Supplement
Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
Corrective Assignment to Correct the Remove Application 12092129 Previously Recorded on Reel 038017 Frame 0058. Assignor(S) Hereby Confirms the Security Agreement Supplement.
Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
Patent Release
Aug 17, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 039707/0471 →
Corrective Assignment to Correct the Remove Application 12681366 Previously Recorded on Reel 039361 Frame 0212. Assignor(S) Hereby Confirms the Security Agreement Supplement.
May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
Corrective Assignment to Correct the Remove Application 12681366 Previously Recorded on Reel 038017 Frame 0058. Assignor(S) Hereby Confirms the Security Agreement Supplement.
May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
Release of Security Interest
Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
Corrective Assignment to Correct the Remove Application 12298143 Previously Recorded on Reel 042762 Frame 0145. Assignor(S) Hereby Confirms the Security Agreement Supplement.
Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
Corrective Assignment to Correct the Remove Application 12298143 Previously Recorded on Reel 042985 Frame 0001. Assignor(S) Hereby Confirms the Security Agreement Supplement.
Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
Corrective Assignment to Correct the Remove Application 12298143 Previously Recorded on Reel 038017 Frame 0058. Assignor(S) Hereby Confirms the Security Agreement Supplement.
Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
Corrective Assignment to Correct the Remove Application 12298143 Previously Recorded on Reel 039361 Frame 0212. Assignor(S) Hereby Confirms the Security Agreement Supplement.
Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
Corrective Assignment to Correct the Assignor's Data Previously Recorded on Reel 020028 Frame 0215. Assignor(S) Hereby Confirms the Assignment.
Mar 24, 2020
From: GAMAND, PATRICE; YANNOU, JEAN-MARC; VERJUS, FABRICE; CATHELIN, CYRILLE
To: NXP B.V.
Reel/Frame 052218/0811 →
Assignment of Assignor's Interest
Mar 26, 2020
From: ST-ERICSSON SA, EN LIQUIDATION
To: OPTIS CIRCUIT TECHNOLOGY, LLC
Reel/Frame 052248/0262 →