Patent Assignment
Reel/Frame 020030/0866
Assignment of Assignor's Interest
Recorded: 2007-10-29
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI,, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer Stacked Package Having Vertical Heat Emission Path and Method of Fabricating the Same