Patent Assignment
Reel/Frame 020032/0174
Assignment of Assignor's Interest
Recorded: 2007-10-29
Pages: 2
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Manufacturing Method of Resin-Molding Type Semiconductor Device, and Wiring Board Therefor
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.