Manufacturing method of resin-molding type semiconductor device, and wiring board therefor
View Patent ↗A wiring board for manufacturing a resin-molding type semiconductor device includes a plurality of element regions each having a mount region on which a semiconductor element is mounted and an electrode wire, and a peripheral region surrounding the plurality of element regions and having resin-gripping means such as through holes engaged with a resin with which the plurality of element regions and the peripheral region are sealed.
1. A wiring board comprising:
a plurality of element regions, each having a mount region and at least one electrode wire, said element regions for being separated from one another by cutting;
a semiconductor element mounted on said mount region;
a peripheral region surrounding the plurality of element regions and including neither an electrode wire nor an electrical lead;
resin, for sealing said element regions, said semiconductor element, and said peripheral region; and
a plurality of through holes located in the peripheral region for engaging said resin.
2. The wiring board according to claim 1 , wherein
the plurality of element regions are arranged in a matrix form, such that the element regions are arranged in rows that are perpendicular to one another.
3. The wiring board according to claim 2 , wherein
the through holes are located at opposite ends of each row of the element regions.
4. The wiring board according to claim 2 , wherein
the through holes are located adjacent each outside edge of said matrix.
5. The wiring board according to claim 2 , wherein
the through holes are arranged in multiple rows parallel to a respective adjacent outside edge of said matrix.
6. The wiring board according to claim 2 , wherein
the through holes are arranged in parallel, staggered rows, parallel to a respective adjacent outside edge of said matrix.
7. The wiring board according to claim 2 , wherein
the through holes are further located in an area of the wiring board outside the peripheral region.
8. A wiring board comprising:
a plurality of element regions, each having a mount region and at least one electrode wire, said element regions for being separated from one another by cutting;
a semiconductor element mounted on said mount region;
a peripheral region surrounding the plurality of element regions and including neither an electrode wire nor an electrical lead;
resin, for sealing said element regions, said semiconductor element, and said peripheral region; and
a plurality of resin-gripping means comprising either a concave part or a convex part, said resin-gripping means located on the peripheral region of the wiring board and coated with said resin.
9. The wiring board according to claim 8 , wherein
the convex part is a resist.
10. The wiring board according to claim 8 , wherein
the convex part comprises a metal pattern coated with a resist.
11. The wiring board according to claim 10 , wherein
the metal pattern is the same metal as the electrode wire.
12. The wiring board according to claim 8 , wherein the plurality of element regions are arranged in a matrix form, such that the element regions are arranged in rows that are perpendicular to one another.
13. The wiring board according to claim 12 , wherein the concave parts or the convex parts are located at opposite ends of each row of the element regions.
14. The wiring board according to claim 12 , wherein the concave parts or the convex parts are located adjacent each outside edge of said matrix.
15. The wiring board according to claim 12 , wherein the concave parts or the convex parts are arranged in multiple rows parallel to a respective adjacent outside edge of said matrix.
16. The wiring board according to claim 12 , wherein the concave parts or the convex parts are arranged in parallel, staggered rows, parallel to a respective adjacent outside edge of said matrix.