IP Library › Assignment 020035/0545
Patent Assignment
Reel/Frame 020035/0545

Assignment of Assignor's Interest

Recorded: 2007-10-29 Pages: 2
Assignor
SUPERNOVA OPTOELECTRONICS CORP.
Executed: 2007-10-09
Assignee
INTEMATIX TECHNOLOGY CENTER CORP.
9F., NO. 5-2, CINGNIAM RD., YANGMEI TOWNSHIP, TAOYUAN COUNTY 326, R.O.C., TAIWAN
Covered Property (1)
Flip-Chip Packaged Smd-Type Led with Antistatic Function and Having No Wire Bonding
Patent: 7,098,543 →
Application: 10/982,767 →
Publication: US 2006/0012053
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 15, 2004
From: LAI, MU-JEN
To: SUPERNOVA OPTOELECTRONICS CORPORATION
Reel/Frame 015378/0637 →
Change of Name Aug 22, 2013
From: INTEMATIX TECHNOLOGY CENTER CORP.
To: INTERLIGHT OPTOTECH CORPORATION
Reel/Frame 031075/0859 →
Security Interest Oct 27, 2015
From: INTEMATIX HONG KONG CO. LIMITED; INTEMATIX CORPORATION
To: EAST WEST BANK
Reel/Frame 036967/0623 →
Assignment of Assignor's Interest Aug 7, 2018
From: INTERLIGHT OPTOTECH CORPORATION
To: EPISTAR CORPORATION
Reel/Frame 046577/0566 →
Release of Security Interest Apr 14, 2022
From: EAST WEST BANK
To: INTEMATIX HONG KONG CO. LIMITED; INTEMATIX CORPORATION
Reel/Frame 059910/0304 →