Patent Assignment
Reel/Frame 020039/0051
Assignment of Assignor's Interest
Recorded: 2007-10-30
Pages: 3
Assignors
TSAO, PEI-HAW
Executed: 2007-10-24
LIN, LIANG-CHEN
Executed: 2007-10-24
NIU, PAO-KANG
Executed: 2007-10-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Flip Chip Packages with Spacers Separating Heat Sinks and Substrates