Patent Assignment
Reel/Frame 020042/0530
Assignment of Assignor's Interest
Recorded: 2007-10-19
Pages: 3
Assignors
JUNG, HOE-KU
Executed: 2007-09-21
YOO, JE-GWANG
Executed: 2007-09-21
KANG, MYUNG-SAM
Executed: 2007-09-21
KIM, JI-EUN
Executed: 2007-09-21
PARK, JEONG-WOO
Executed: 2007-09-21
PARK, JUNG-HYUN
Executed: 2007-09-21
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN3-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO 443-743, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Circuit Board