IP Library › Assignment 020058/0155
Patent Assignment
Reel/Frame 020058/0155

Assignment of Assignor's Interest

Recorded: 2007-11-02 Pages: 3
Assignor
HATA, HIROSHI
Executed: 2007-08-16
Assignee
SHOWA DENKO PACKAGING CO.
31, SUZUKAWA, ISEHARA-SHI, KANAGAWA, 259-1146, JAPAN
Covered Property (1)
Process for the Production of Packaging Material for Electronic Component Cases
Patent: 8,221,576 →
Application: 11/913,422 →
Publication: US 2009/0258173
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jul 25, 2023
From: SHOWA DENKO PACKAGING CO.
To: RESONAC PACKAGING CORPORATION
Reel/Frame 064370/0076 →
Corrective Assignment to Correct the the Assignee's Address Previously Recorded at Reel: 064370 Frame: 0076. Assignor(S) Hereby Confirms the Assignment . Aug 18, 2023
From: SHOWA DENKO PACKAGING CO.
To: RESONAC PACKAGING CORPORATION
Reel/Frame 064636/0383 →