Patent Assignment
Reel/Frame 020062/0942
Assignment of Assignor's Interest
Recorded: 2007-11-02
Pages: 4
Assignors
KUO, CHEN-CHENG
Executed: 2007-09-06
CHEN-SHIEN, CHEN
Executed: 2007-09-06
CHING, KAI-MING
Executed: 2007-09-06
CHEN, CHIH-HUA
Executed: 2007-09-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Through-Substrate via for Semiconductor Device