Patent Assignment
Reel/Frame 020065/0254
Assignment of Assignor's Interest
Recorded: 2007-11-02
Pages: 2
Assignors
WANG, BILY
Executed: 2007-10-24
CHUANG, JONNIE
Executed: 2007-10-24
CHEN, CHIA-HUNG
Executed: 2007-10-24
Assignee
HARVATEK CORPORATION
NO. 18, LANE 522, SEC. 5, JHONGHUA RD., HSINCHU CITY, R.O.C., TAIWAN
Covered Property
(1)
Led Chip Package Structure Using a Ceramic Material as a Substrate and a Method for Manufacturing the Same