IP Library › Assignment 020081/0570
Patent Assignment
Reel/Frame 020081/0570

Assignment of Assignor's Interest

Recorded: 2007-11-07 Pages: 3
Assignors
MCKINLEY, WILLIAM S.
Executed: 2007-11-01
NICHOLAS, STEVE T.
Executed: 2007-11-01
DEAN, JEFFERY A.
Executed: 2007-11-01
Assignee
LOCKHEED MARTIN CORPORATION
6801 ROCKLEDGE DRIVE, BETHESDA, MARYLAND, 20817
Covered Property (1)
Method of Making a Wiring Board Having an Engineered Metallization Layer
Patent: 8,245,390 →
Application: 11/935,994 →
Publication: US 2009/0113705