IP Library › Assignment 020113/0983
Patent Assignment
Reel/Frame 020113/0983

Assignment of Assignor's Interest

Recorded: 2007-11-15 Pages: 4
Assignors
LIN, MOU-SHIUNG
Executed: 2004-02-01
CHEN, MICHAEL
Executed: 2004-02-01
CHOU, CHIEN-KANG
Executed: 2004-02-01
CHOU, MARK
Executed: 2004-02-01
Assignee
MEGICA CORPORATION
ROOM 301/302, NO. 47, PARK 2ND RD.,, HSINCHU, 300, TAIWAN
Covered Property (1)
Wirebond Pad for Semiconductor Chip or Wafer
Patent: 8,187,965 →
Application: 11/756,621 →
Publication: US 2009/0053887
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →