Patent Assignment
Reel/Frame 020117/0740
Assignment of Assignor's Interest
Recorded: 2007-11-15
Pages: 3
Assignor
JOH, CHEOL HO
Executed: 2007-10-29
Assignee
HYNIX SEMICONDUCTOR INC.
SAN 136-1, AMI-RI, BUBAL-EUB, ICHEON-SI, KYOUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Stacked Semiconductor Package That Prevents Damage to Semiconductor Chip When Wire-Bonding and Method for Manufacturing the Same