Patent Assignment
Reel/Frame 020120/0402
Assignment of Assignor's Interest
Recorded: 2007-11-15
Pages: 6
Assignors
MATSUDA, MITSUYOSHI
Executed: 2007-10-09
SAKAI, HISAO
Executed: 2007-10-07
TOMONAGA, SAKIKO
Executed: 2007-10-09
DOBASHI, MAKOTO
Executed: 2007-10-09
Assignee
MITSUI MINING & SMELTING CO., LTD.
11-1, OSAKI 1-CHOME, SHINAGAWA-KU, TOKYO, 1418584, JAPAN
Covered Property
(1)
Electrodeposited copper foil, its manufacturing method, surface-treated electrodeposited copper foil using the electrodeposited copper foil, and copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foil