IP Library › Assignment 020139/0549
Patent Assignment
Reel/Frame 020139/0549

Assignment of Assignor's Interest

Recorded: 2007-11-20 Pages: 4
Assignors
SUZUKI, KENJI
Executed: 2007-10-15
TADAHIRO, ISHIZAKA
Executed: 2007-10-15
JOMEN, MIHO
Executed: 2007-10-15
RULLAN, JONATHAN
Executed: 2007-10-15
Assignee
TOKYO ELECTRON LIMITED
3-6 AKASAKA 5-CHOME, MINATO-KU, TBS BROADCAST CENTER, TOKYO, 107, JAPAN
Covered Property (1)
Void-Free Copper Filling of Recessed Features for Semiconductor Devices
Patent: 7,884,012 →
Application: 11/864,566 →
Publication: US 2009/0087981
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Name of the Second Assignor from Ishizaka Tadahiro to Tadahiro Ishizaka Previously Recorded on Reel 020139 Frame 0549. Assignor(S) Hereby Confirms the Correct Name of the Second Assignor Is Tadahiro Ishizaka as Signed on the Original Assignment Document. Sep 28, 2010
From: SUZUKI, KENJI; ISHIZAKA, TADAHIRO; JOMEN, MIHO; RULLAN, JONATHAN
To: TOKYO ELECTRON LIMITED
Reel/Frame 025053/0268 →