Patent Assignment
Reel/Frame 020151/0781
Assignment of Assignor's Interest
Recorded: 2007-11-13
Pages: 4
Assignor
ISHIDO, KIMINORI
Executed: 2007-11-06
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Printed wiring board having plural solder resist layers and method for production thereof
Application:
11/984,037 →
Publication:
US 2008/0135279
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.