Patent Assignment
Reel/Frame 025235/0423
Change of Name
Recorded: 2010-11-02
Pages: 9
Assignor
NEC ELECTRONICS CORPORATION
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU,, KAWASAKI-SHI, KANAGAWA, 211-8668, JAPAN
Covered Properties
(92)
Printed wiring board having plural solder resist layers and method for production thereof
Application:
11/984,037 →
Publication:
US 2008/0135279
Semiconductor Device and Method for Manufacturing the Same
Semiconductor device, manufacturing method thereof, and SRAM cell
Application:
11/984,045 →
Publication:
US 2008/0135942
Resistance Dividing Circuit
Semiconductor Integrated Circuit Device Having Internal Voltage Generating Circuit
Display Device, Driver Circuit Therefor, and Method of Driving Same
Semiconductor Device Including Protection Circuit and Switch Circuit and Its Testing Method
Receiving apparatus
Application:
11/984,491 →
Publication:
US 2008/0181347
Bus Relay Device and Bus Control System Including Plurality of Bus Masters, Bus Slave, Interconnect Section, and Bridge Section
Error Correction Device and Recording and Reproducing Device
Display Device and Controller Driver for Improved Frc Technique
Semiconductor device having zener diode and method for manufacturing the same
Application:
11/984,796 →
Publication:
US 2008/0142799
Method of Testing Semiconductor Apparatus
Semiconductor Device
Two-Way Communication Circuit, Two-Way Communication System, and Communication Method of Two-Way Communication Circuit
Semiconductor device including microstrip line and coplanar line
Application:
11/987,624 →
Publication:
US 2008/0128916
Semiconductor Integrated Circuit Device
Data Driver and Display Apparatus Using the Same Including Clock Control Circuit and Shift Register Circuit
Layout Method of Semiconductor Integrated Circuit and Computer Readable Storage Medium Storing Layout Program Thereof
Apparatus and Method for Driving Display Panel Including Control of Charge Pump
Method for Manufacturing Semiconductor Device
Mosfet and Production Method of Semiconductor Device
Semiconductor Memory Device and Method of Manufacturing the Same
Application:
11/992,961 →
Publication:
US 2009/0140322
Buried Semiconductor Laser and Method for Manufacturing the Same
Information Processor and Instruction Fetch Control Method
Display driver including grayscale voltage generator having plural resistors in series each having suitable width
Application:
12/000,253 →
Publication:
US 2008/0136848
Backlight brightness control for liquid crystal display panel using a frequency-divided clock signal
Nonvolatile Semiconductor Memory Having Suitable Crystal Orientation
Semiconductor Chip
Booster Circuit
Display Apparatus, Source Driver, and Display Panel Driving Method
Semiconductor device having a indicator indicating cleavage direction
Application:
12/003,168 →
Publication:
US 2008/0157286
Battery Voltage Monitoring Apparatus
Liquid crystal display device and method of driving liquid crystal display device
Application:
12/007,029 →
Publication:
US 2008/0180462
Battery Voltage Measuring System
Wiring Board
Simulation system, simulation method and simulation program
Application:
12/007,437 →
Publication:
US 2008/0177527
Power Supply Circuit for Display Unit and Display Unit
Method of Processing Dummy Pattern Based on Boundary Length and Density of Wiring Pattern, Semiconductor Design Apparatus and Semiconductor Device
Power Semiconductor Device Architecture for Output Transistor Protection
Phase Shifter Including a Resonant Type Switch with a Free Region
Semiconductor Device Including Plural Guard Rings and Plural Contact Groups
Application:
12/007,759 →
Publication:
US 2008/0169509
Decoding Method and Decoding Circuit
Communication System, Communication Device and Flow Control Based on Status Information of Data Buffer Usage
Transmitter and Receiver Capable of Reducing Current Consumption and Signal Lines for Data Transfer
Test pattern generation circuit having plural pseudo random number generation circuits supplied with clock signals at different timing respectively
Application:
12/010,264 →
Publication:
US 2008/0178055
Method of manufacturing semiconductor device
Application:
12/010,287 →
Publication:
US 2008/0176407
Method and Apparatus for Compensating Infrared Sensor for Temperature
Liquid Crystal Display Device, Source Driver, and Method of Driving a Liquid Crystal Display Panel
Semiconductor Integrated Circuit Device Including a Pad and First Mosfet
Semiconductor Device, and Test Circuit and Test Method for Testing Semiconductor Device
Test Pattern Generating Device and Test Pattern Generating Method
Application:
12/014,119 →
Publication:
US 2008/0222473
Method of Manufacturing Semiconductor Device
Application:
12/014,814 →
Publication:
US 2008/0194096
Semiconductor Memory Device Having Selectable Transfer Modes
Phase Shifter Having Switchable Signal Paths Where One Signal Path Includes No Shunt Capacitor and Inductor
Semiconductor Device
Positional Offset Measurement Pattern Unit Featuring via-Plug and Interconnections, and Method Using Such Positional Offset Measurement Pattern Unit
Semiconductor Device and Method of Testing Semiconductor Device
Electrolytic Ni Plating Apparatus and Method of Manufacturing Semiconductor Device
Application:
12/021,357 →
Publication:
US 2008/0314742
Series Connected Bit Phase Shifter Having First and Second Impedance Adjusting Circuits
Semiconductor Device
Ccd Image Sensor Having Charge Storage Section Between Photodiode Section and Charge Transfer Section
Dynamic Random Access Memory Device Suppressing Need for Voltage-Boosting Current Consumption
Driver and Display Method Using the Same
Application:
12/026,613 →
Publication:
US 2008/0191990
Stream Reproduction Apparatus and Stream Reproduction Method
Application:
12/028,016 →
Publication:
US 2008/0199146
Semiconductor Manufacturing Apparatus and Method for Manufacturing Semiconductor Device
Application:
12/028,225 →
Publication:
US 2008/0190451
System and Method for Digital Signal Transmission with Reduced Error Rate
Configuration Layout Number Controlled Adjustable Delaying of Connection Path Changes Among Processors in Array to Reduce Transition Glitches
Semiconductor Memory Device
Semiconductor Integrated Circuit Device and Layout Method Thereof
Semiconductor Device and Method for Producing the Same
Viterbi Decoding System and Viterbi Decoding Method
Application:
12/035,534 →
Publication:
US 2008/0209305
Lateral Mosfet and Manufacturing Method Thereof
Semiconductor Device and Manufacturing Process for the Same
Application:
12/040,315 →
Publication:
US 2008/0224196
Semiconductor Device
Application:
12/040,937 →
Publication:
US 2008/0211099
Semiconductor Device and Method of Visual Inspection and Apparatus for Visual Inspection
Semiconductor Device
Semiconductor Device Having Improved Heat Sink
Method of Manufacturing Semiconductor Device
Semiconductor Device and Method of Manufacturing the Same
Application:
12/045,748 →
Publication:
US 2008/0224324
Differential Amplifier and Data Driver Employing the Differential Amplifier
Semiconductor Device Having High-Frequency Interconnect
Application:
12/046,490 →
Publication:
US 2008/0272495
Semiconductor Device with a High-Frequency Interconnect
Method of Manufacturing Semiconductor Device
Photo Coupler and Method for Producing the Same
Method of Manufacturing Semiconductor Device
Lead Frame, Semiconductor Device, and Method of Manufacturing the Semiconductor Device
Method of Manufacturing Semiconductor Device
Method of Placing Wires
Method of Driving a Color Liquid Crystal Display and Driver Circuit for Driving the Display as Well as Portable Electronic Device with the Driver Circuit
Thin Planar Semiconductor Device
Semiconductor Device and Method of Manufacturing the Same
Related Assignments
(19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 13, 2007
From: MURASE, YOSHIMITSU; KOBAYASHI, KENYA; YAMAMOTO, HIDEO; KANEKO, ATSUSHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020151/0750 →
Assignment of Assignor's Interest
Nov 13, 2007
From: MINAGAWA, SUMITO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020151/0777 →
Assignment of Assignor's Interest
Nov 13, 2007
From: ISHIDO, KIMINORI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020151/0781 →
Assignment of Assignor's Interest
Nov 13, 2007
From: OKUTANI, SHIGEKI; TAKAHASHI, MASAHARU
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020151/0922 →
Assignment of Assignor's Interest
Nov 13, 2007
From: OKAMOTO, TOSHIHARU
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020155/0109 →
Assignment of Assignor's Interest
Nov 16, 2007
From: YOSHIDA, MITSURU
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020163/0445 →
Assignment of Assignor's Interest
Nov 16, 2007
From: HASHIMOTO, YOSHIHARU
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020167/0289 →
Assignment of Assignor's Interest
Nov 19, 2007
From: NAKAMURA, YOSHIAKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020175/0885 →
Assignment of Assignor's Interest
Nov 20, 2007
From: KAZAMA, ATSUSHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020177/0372 →
Assignment of Assignor's Interest
Nov 20, 2007
From: KADOMATSU, TERUHIRO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020191/0366 →
Assignment of Assignor's Interest
Nov 21, 2007
From: FURIHATA, HIROBUMI; NOSE, TAKASHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020191/0076 →
Assignment of Assignor's Interest
Nov 21, 2007
From: KANEKO, ATSUSHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020193/0565 →
Assignment of Assignor's Interest
Nov 27, 2007
From: AKIYAMA, NAOTO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020215/0912 →
Assignment of Assignor's Interest
Dec 3, 2007
From: SOEJIMA, KOJI; KAWANO, MASAYA; KURITA, YOICHIRIO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020239/0673 →
Assignment of Assignor's Interest
Dec 5, 2007
From: FURUTA, HIROSHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020248/0083 →
Assignment of Assignor's Interest
Dec 5, 2007
From: NAKAMURA, KAZUO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020248/0099 →
Assignment of Assignor's Interest
Dec 5, 2007
From: HIROTA, KATSUHISA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020248/0208 →
Request to Correct Assignor's Name on an Assignment Document Previously Recorded at Reel 020239 Frame 0673
Mar 21, 2008
From: SOEJIMA, KOJI; KAWANO, MASAYA; KURITA, YOICHIRO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020724/0664 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →