Patent Assignment
Reel/Frame 020161/0407
Assignment of Assignor's Interest
Recorded: 2007-11-13
Pages: 3
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO 381-2287, JAPAN
Covered Property
(1)
Wiring Substrate, Manufacturing Method Thereof, and Semiconductor Device