Patent Assignment
Reel/Frame 020184/0107
Assignment of Assignor's Interest
Recorded: 2007-12-03
Pages: 3
Assignee
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
NO. 195, SECTION 4, CHUNG HSING ROAD, CHUTUNG, HSINCHU, TAIWAN
Covered Property
(1)
Package and Packaging Assembly of Microelectromechanical Sysyem Microphone