Patent Assignment
Reel/Frame 020191/0502
Assignment of Assignor's Interest
Recorded: 2007-11-20
Pages: 4
Assignors
MIYAZAKI, SUSUMU
Executed: 2007-10-04
TAKEI, TOKIO
Executed: 2007-10-04
OKABE, KEIICHI
Executed: 2007-10-04
Assignee
SHIN-ETSU HANDOTAI CO., LTD.
6-2, OHTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Method for Manufacturing Bonded Wafer and Outer-Peripheral Grinding Machine of Bonded Wafer