Patent Assignment
Reel/Frame 020204/0590
Assignment of Assignor's Interest
Recorded: 2007-12-06
Pages: 2
Assignor
EREZ, ERAN
Executed: 2007-12-03
Assignee
SANDISK IL LTD.
7 ATIR YEDA STREET, KFAR SABA, ISRAEL
Covered Property
(1)
Integrated Circuit Die with Logically Equivalent Bonding Pads
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 27, 2005
From: RONEN, AMIR
To: M-SYSTEMS FLASH DISK PIONEERS, LTD.
Reel/Frame 016816/0796 →
Change of Name
Nov 6, 2008
From: M-SYSTEMS FLASH DISK PIONEERS LTD.
To: MSYSTEMS LTD
Reel/Frame 021798/0238 →
Change of Name
Nov 18, 2008
From: MSYSTEMS LTD
To: SANDISK IL LTD.
Reel/Frame 021853/0780 →
Change of Name
Aug 21, 2020
From: SANDISK IL LTD
To: WESTERN DIGITAL ISRAEL LTD
Reel/Frame 053574/0513 →
Change of Name
Jun 10, 2025
From: WESTERN DIGITAL ISRAEL LTD.
To: SANDISK ISRAEL LTD.
Reel/Frame 071587/0836 →