Patent Assignment
Reel/Frame 020214/0783
Assignment of Assignor's Interest
Recorded: 2007-11-28
Pages: 2
Assignor
DUNNE, RAJIV C.
Executed: 2007-01-23
Assignee
TEXAS INSTRUMENTS INCORPORATED
P.O. BOX 655474, MS 3999, DALLAS, TEXAS, 75265
Covered Property
(1)
Stacked-Flip-Assembled Semiconductor Chips Embedded in Thin Hybrid Substrate