IP Library › Assignment 020221/0198
Patent Assignment
Reel/Frame 020221/0198

Assignment of Assignor's Interest

Recorded: 2007-12-10 Pages: 3
Assignors
JADHAV, VIRENDRA R.
Executed: 2007-11-30
SHAH, JAYSHREE
Executed: 2007-11-30
SRIVASTAVA, KAMALESH K.
Executed: 2007-11-30
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Flip-Chip Assembly with Organic Chip Carrier Having Mushroom-Plated Solder Resist Opening
Patent: 7,952,207 →
Application: 11/950,431 →
Publication: US 2009/0146316
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 29, 2013
From: INTERNATIONAL BUSINESS MACHINES
To: ULTRATECH, INC.
Reel/Frame 031111/0438 →