Patent Assignment
Reel/Frame 031111/0438
Assignment of Assignor's Interest
Recorded: 2013-08-29
Pages: 8
Assignor
INTERNATIONAL BUSINESS MACHINES
Executed: 2013-08-05
Assignee
ULTRATECH, INC.
3050 ZANKER ROAD, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(20)
Multi-Layered Interconnect Structure Using Liquid Crystalline Polymer Dielectric
Multi-Layered Interconnect Structure Using Liquid Crystalline Polymer Dielectric
Electrical Interconnect Structure and Method
Silicon Germanium Heterojunction Bipolar Transistor Structure and Method
Multi-Layered Interconnect Structure Using Liquid Crystalline Polymer Dielectric
Multi-Layered Interconnect Structure Using Liquid Crystalline Polymer Dielectric
Silicon Germanium Heterojunction Bipolar Transistor Structure and Method
Flip-Chip Assembly with Organic Chip Carrier Having Mushroom-Plated Solder Resist Opening
Structures and Methods for Improving Solder Bump Connections in Semiconductor Devices
Underfill Flow Guide Structures
Method for Forming Retrograded Well for Mosfet
Silicon Germanium Heterojunction Bipolar Transistor Structure and Method
Multi-Layered Interconnect Structure Using Liquid Crystalline Polymer Dielectric
Application:
12/776,771 →
Publication:
US 2010/0218891
Electrical Interconnect Structure
Electrical Interconnect Forming Method
Flip-Chip Assembly with Organic Chip Carrier Having Mushroom-Plated Solder Resist Opening
Application:
13/091,317 →
Publication:
US 2011/0195543
Underfill Flow Guide Structures and Method of Using Same
Structures and Methods for Improving Solder Bump Connections in Semiconductor Devices
Application:
13/360,174 →
Publication:
US 2012/0129336
Method for Forming Retrograded Well for Mosfet
Silicon Germanium Heterojunction Bipolar Transistor Structure and Method
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 14, 2010
From: ZHU, HUILONG; LUO, ZHIJIONG; LIANG, QINGQING; YIN, HAIZHOU
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 023782/0935 →
Assignment of Assignor's Interest
Dec 30, 2019
From: ULTRATECH, INC.
To: VEECO INSTRUMENTS INC.
Reel/Frame 051383/0735 →
Assignment of Assignor's Interest
Dec 30, 2019
From: ULTRATECH, INC.
To: VEECO INSTRUMENTS INC.
Reel/Frame 051446/0476 →
Patent Security Agreement
Dec 16, 2021
From: VEECO INSTRUMENTS INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 058533/0321 →
Security Interest
Jun 16, 2025
From: VEECO INSTRUMENTS INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 071649/0225 →