Underfill flow guide structures
View Patent ↗Underfill flow guide structures and methods of using the same are provided with a module. In particular the underfill flow guide structures are integrated with a substrate and are configured to prevent air entrapment from occurring during capillary underfill processes.
1. A structure comprising:
a substrate having bumps mounted thereon; and
underfill flow guide structures integrated with the substrate and located between adjacent bumps, and configured to uniformly guide underfill along the substrate during capillary underfill processing, wherein:
the underfill flow guide structures are raised three dimensional structures on the substrate; and
the underfill flow guide structures are wires with a overlay of a hard substance.
2. The structure of claim 1 , wherein the bumps are controlled collapse chip connections (C4).
3. The structure of claim 1 , wherein the underfill flow guide structures are at a height of about 4 microns.
4. The structure of claim 3 , wherein the hard substance is a polyimide layer.
5. The structure of claim 1 , wherein the underfill flow guide structures are in a pattern of at least one of: parallel, divergent, sinusoidal, intermittent, extending from an edge to an area within the chip, from edge to edge and overlap or criss-cross.
6. The structure of claim 1 , wherein the underfill flow guide structures run parallel to opposing edges of the substrate and at least one row of the bumps.
7. The structure of claim 1 , wherein the underfill flow guide structures are sinusoidal.
8. The structure of claim 1 , wherein the underfill flow guide structures diverge.
9. A module, comprising:
a substrate having C4 bumps mounted thereon and in contact therewith;
a carrier mounted to the substrate by the C4 bumps;
underfill within a space formed between the substrate and the carrier; and
underfill flow guide structures integrated with the substrate and located between adjacent bumps, and configured to uniformly guide the underfill along the substrate and within the space during underfill processing, wherein the underfill flow guide structures are wires with a overlay of a hard substance.
10. The module of claim 9 , wherein the hard substance is a polyimide layer.
11. The module of claim 9 , wherein the underfill flow guide structures are in a pattern of at least one of: parallel, divergent, sinusoidal, intermittent, extend from an edge to an area within the chip, from edge to edge and overlap or criss-cross.