IP Library › Assignment 020226/0747
Patent Assignment
Reel/Frame 020226/0747

Assignment of Assignor's Interest

Recorded: 2007-12-11 Pages: 4
Assignors
YANG, WEN-KUN
Executed: 2007-12-05
CHANG, JUI-HSIEN
Executed: 2007-12-05
Assignee
ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
NO. 65, GUANGFU N. RD., HUKOU TOWNSHIP, HSINCHU COUNTY, 303, TAIWAN
Covered Property (1)
Sensor Module Package Structure and Method of the Same
Patent: 7,423,335 →
Application: 11/954,087 →
Publication: US 2008/0157250
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Sep 15, 2023
From: ADL ENGINEERING INC.; ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
To: ADL ENGINEERING INC.
Reel/Frame 064926/0845 →
Change of Name Sep 15, 2023
From: ADL ENGINEERING INC.
To: ADL ENERGY CORP.
Reel/Frame 064927/0462 →
Assignment of Assignor's Interest Dec 27, 2023
From: ADL ENERGY CORP.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 065957/0661 →