Patent Assignment
Reel/Frame 020244/0951
Assignment of Assignor's Interest
Recorded: 2007-12-13
Pages: 2
Assignor
OHKAWA, HIROSHI
Executed: 2007-05-10
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Semiconductor device and fabrication method thereof
Application:
11/806,883 →
Publication:
US 2008/0017927
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.