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App. No. 11/806,883 · Confirmation No. 1498

Semiconductor device and fabrication method thereof

Inventor: Hiroshi Ohkawa
Abandoned -- Failure to Respond to an Office Action View Publication ↗
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2009-04-30 ABN Abandonment 2 View
2008-10-17 CTRS Requirement for Restriction/Election 6 View
2008-10-17 FWCLM Index of Claims 1 View
2008-01-24 NTC.PUB Notice of Publication 1 View
2007-09-14 APP.FILE.REC Filing Receipt 3 View
2007-08-30 PEFR Applicant Response to Pre-Exam Formalities Notice 5 View
2007-08-30 DRW Drawings-only black and white line drawings 14 View
2007-07-05 APP.FILE.REC Filing Receipt 3 View
2007-07-05 PEFN Pre-Exam Formalities Notice 2 View
2007-06-05 WFEE Fee Worksheet (SB06) 1 View
2007-06-05 WFEE Fee Worksheet (SB06) 1 View
2007-06-05 TRNA Transmittal of New Application 2 View
2007-06-05 SPEC Specification 18 View
2007-06-05 CLM Claims 5 View
2007-06-05 ABST Abstract 1 View
2007-06-05 DRW Drawings-only black and white line drawings 14 View
2007-06-05 OATH Oath or Declaration filed 2 View
2007-06-05 FRPR Certified Copy of Foreign Priority Application 32 View
2007-06-05 IDS Information Disclosure Statement (IDS) Form (SB08) 3 View
2007-06-05 136A Authorization for Extension of Time all replies 2 View
2007-06-05 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
11/806,883
Filed
2007-06-05
Pub. No.
US20080017927A1
Art Unit
2826