Patent Assignment
Reel/Frame 020246/0293
Assignment of Assignor's Interest
Recorded: 2007-12-14
Pages: 2
Assignors
CHAPMAN, PHILLIP FRANCIS
Executed: 2007-12-11
COLLINS, DAVID S.
Executed: 2007-12-11
VOLDMAN, STEVEN H.
Executed: 2007-12-12
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Latchup Robust Array I/O Using Through Wafer Via