Patent Assignment
Reel/Frame 020259/0329
Assignment of Assignor's Interest
Recorded: 2007-11-30
Pages: 5
Assignors
TSUJITA, KEIJI
Executed: 2007-10-25
TANAKA, HIDEYUKI
Executed: 2007-10-25
KUGE, MORIMASA
Executed: 2007-10-25
NAKAYAMA, SYUICHI
Executed: 2007-10-15
SUGIYAMA, SUSUMU
Executed: 2007-10-19
Assignees
CORNING JAPAN K.K.
1-11-44, AKASAKA, MINATO-KU, TOKYO, JAPAN
KAWASAKI PLANT SYSTEMS KABUSHIKI KAISHA
1-1, HIGASHIKAWASAKI-CHO 3-CHOME, CHUO-KU, KOBE-SHI, HYOGO, JAPAN
Covered Property
(1)
Plate Material Cutting Unit, Plate Material Cutting Apparatus Equipped with the Plate Material Cutting Unit, and Plate Material Cutting System Equipped with the Plate Material Cutting Apparatus
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.