Patent Assignment
Reel/Frame 020269/0339
Assignment of Assignor's Interest
Recorded: 2007-12-18
Pages: 4
Assignors
LEE, SANG S.
Executed: 2007-11-23
DONG, CHA DEOK
Executed: 2007-11-23
SHON, HYUN S.
Executed: 2007-11-23
JEONG, WOO R.
Executed: 2007-11-23
Assignee
HYNIX SEMICONDUCTOR INC.
SAN 136-1, AMI-RI, BUBAL-EUB, ICHEON-SI, KYOUNGKI-DO, 467-701, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Forming Isolation Layer of Flash Memory Device