Patent Assignment
Reel/Frame 020276/0763
Assignment of Assignor's Interest
Recorded: 2007-12-20
Pages: 4
Assignors
LEE, JE-HUN
Executed: 2007-12-03
JEONG, CHANG-OH
Executed: 2007-12-03
LEE, EUN-GUK
Executed: 2007-12-03
KIM, DO-HYUN
Executed: 2007-12-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
#416, MAETAN-DONG,, YEONGTONG-GU, SUWON-SI,, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Wire Structure, Method for Fabricating Wire, Thin Film Transistor Substrate, and Method for Fabricating the Thin Film Transistor Substrate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.