Patent Assignment
Reel/Frame 020281/0173
Assignment of Assignor's Interest
Recorded: 2007-12-20
Pages: 2
Assignors
IKEDA, YASUNOBU
Executed: 2007-07-03
TOMITA, SHINICHI
Executed: 2007-07-10
MIYAHARA, HIROYUKI
Executed: 2007-07-04
Assignee
SUMCO CORPORATION
2-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-8634, JAPAN
Covered Property
(1)
Method for Manufacturing Bonded Soi Wafer and Bonded Soi Wafer Manufactured Thereby