IP Library Assignment 020282/0547
Patent Assignment
Reel/Frame 020282/0547

Assignment of Assignor's Interest

Recorded: 2007-12-21 Pages: 3
Assignor
SIR, JIUN HANN
Executed: 2004-10-05
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052
Covered Property (1)
Interconnects with Direct Metalization and Conductive Polymer
Patent: 7,365,007 →
Application: 10/882,468 →
Publication: US 2006/0003579
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 8, 2016
From: INTEL CORPORATION
To: BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
Reel/Frame 037733/0440 →