Patent Assignment
Reel/Frame 020319/0807
Assignment of Assignor's Interest
Recorded: 2008-01-02
Pages: 2
Assignors
MAEDA, TAKAHIRO
Executed: 2007-12-14
MAEDA, KIYOHIKO
Executed: 2007-12-14
OZAKI, TAKASHI
Executed: 2007-12-14
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO 101-8980, JAPAN
Covered Property
(1)
Substrate Processing Apparatus, Method of Manufacturing a Semiconductor Device, and Method of Forming a Thin Film on Metal Surface
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.