IP Library Assignment 020319/0865
Patent Assignment
Reel/Frame 020319/0865

Assignment of Assignor's Interest

Recorded: 2008-01-04 Pages: 2
Assignor
KUMMERL, STEVEN
Executed: 2007-12-20
Assignee
TEXAS INSTRUMENTS INCORPORATED
7839 CHURCHILL WAY, M/S 3999, DALLAS, TEXAS, 75251
Covered Property (1)
Leadframe and Mold Compound Interlock in Packaged Semiconductor Device
Patent: 7,741,704 →
Application: 11/874,760 →
Publication: US 2008/0093715
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 4, 2008
From: LANGE, BERNHARD
To: TEXAS INSTRUMENTS DEUTSCHLAND GMBH
Reel/Frame 020319/0893 →
Assignment of Assignor's Interest Feb 16, 2021
From: TEXAS INSTRUMENTS DEUTSCHLAND GMBH
To: TEXAS INSTRUMENTS INCORPORATED
Reel/Frame 055314/0255 →