IP Library › Assignment 020319/0893
Patent Assignment
Reel/Frame 020319/0893

Assignment of Assignor's Interest

Recorded: 2008-01-04 Pages: 3
Assignor
LANGE, BERNHARD
Executed: 2007-12-21
Assignee
TEXAS INSTRUMENTS DEUTSCHLAND GMBH
HAGGERTYSTRASSE 1, FREISING, 85356, GERMANY
Covered Property (1)
Leadframe and Mold Compound Interlock in Packaged Semiconductor Device
Patent: 7,741,704 →
Application: 11/874,760 →
Publication: US 2008/0093715
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 4, 2008
From: KUMMERL, STEVEN
To: TEXAS INSTRUMENTS INCORPORATED
Reel/Frame 020319/0865 →
Assignment of Assignor's Interest Feb 16, 2021
From: TEXAS INSTRUMENTS DEUTSCHLAND GMBH
To: TEXAS INSTRUMENTS INCORPORATED
Reel/Frame 055314/0255 →