Patent Assignment
Reel/Frame 020333/0962
Assignment of Assignor's Interest
Recorded: 2008-01-08
Pages: 4
Assignors
HOHAGE, JOERG
Executed: 2007-06-19
KAHLERT, VOLKER
Executed: 2007-06-19
RUELKE, HARTMUT
Executed: 2007-06-19
MAYER, ULRICH
Executed: 2007-06-19
Assignee
ADVANCED MICRO DEVICES, INC.
5204 EAST BEN WHITE BOULEVARD, AUSTIN, TEXAS, 78741
Covered Property
(1)
Method of Forming a Dielectric Cap Layer for a Copper Metallization by Using a Hydrogen Based Thermal-Chemical Treatment