Patent Assignment
Reel/Frame 020337/0710
Assignment of Assignor's Interest
Recorded: 2007-12-26
Pages: 2
Assignee
ROHM CO., LTD.
21, SAIIN MIZOSAKI-CHO, UKYO-KU, KYOTO-SHI, KYOTO 615-8585, JAPAN
Covered Property
(1)
Semiconductor device employing wafer level chip size package technology