Patent Assignment
Reel/Frame 020342/0671
Assignment of Assignor's Interest
Recorded: 2008-01-09
Pages: 4
Assignors
WANG, CHUNG YU
Executed: 2007-10-30
LEE, CHIEN-HSIUN
Executed: 2007-10-31
TSAO, PEI-HAW
Executed: 2007-10-31
CHANG, KUO-CHIN
Executed: 2007-11-01
LIN, CHUNG-YI
Executed: 2007-11-01
KIANG, BILL
Executed: 2007-11-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Protected Solder Ball Joints in Wafer Level Chip-Scale Packaging