Patent Assignment
Reel/Frame 020345/0462
Assignment of Assignor's Interest
Recorded: 2007-12-27
Pages: 3
Assignors
LEE, BYOUNG HWA
Executed: 2007-11-21
WI, SUNG KWON
Executed: 2007-11-21
CHUNG, HAE SUK
Executed: 2007-11-21
PARK, DONG SEOK
Executed: 2007-11-21
PARK, SANG SOO
Executed: 2007-11-21
PARK, MIN CHEOL
Executed: 2007-11-21
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Chip Capacitor