IP Library Granted Patent US 7,733,628
Granted Patent B2
US 7,733,628 · App. 12/005,300 · Granted Jun 8, 2010

Multilayer chip capacitor

Assignee: Samsung Electro-Mechanics Co., Ltd.
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Quick Facts
Patent No.
US 7,733,628
App. No.
12/005,300
Granted
Jun 8, 2010
Kind
B2
Abstract

A multilayer chip capacitor including: a capacitor body having a plurality of dielectric layers deposited therein and having a parallelepiped shape; at least three pairs of first and second external electrodes formed on two longer sides, the first and second external electrodes in each of the pairs having different polarities and opposing each other, and the first and second external electrodes on each of the longer sides arranged alternately with each other; and a plurality of first and second internal electrodes arranged alternately to interpose each of the dielectric layers, the first and second internal electrodes connected to the first and second external electrodes by leads, respectively, wherein the capacitor body has a length that is 2.5 times greater than a width thereof.

Claims (15)

1. A multilayer chip capacitor comprising:

a capacitor body having a plurality of dielectric layers deposited therein and having a parallelepiped shape;

at least three pairs of first and second external electrodes formed on two longer sides, the first and second external electrodes in each of the pairs having different polarities and opposing each other, and the first and second external electrodes on each of the longer sides arranged alternately with each other; and

a plurality of first and second internal electrodes arranged alternately to interpose each of the dielectric layers, the first and second internal electrodes connected to the first and second external electrodes by leads, respectively,

wherein

the capacitor body has a length that is at least 1.1 mm and up to 1.6 mm and the capacitor body has a width that is at least 0.2 mm and up to 0.5 mm, so that the capacitor body has a length that is at least 3 times and up to 7 times a width thereof.

2. The multilayer chip capacitor of claim 1 , wherein the first and second external electrodes of an identical number are formed on the respective longer sides.

3. The multilayer chip capacitor of claim 2 , wherein four pairs of first and second external electrodes are formed on the longer sides.

4. The multilayer chip capacitor of claim 1 , wherein the first and second electrodes of a different number are formed on the respective longer sides.

5. The multilayer chip capacitor of claim 4 , wherein three pairs of first and second external electrodes are formed on the longer sides.

6. A multilayer chip capacitor comprising:

a capacitor body having a plurality of dielectric layers deposited therein and having a parallelepiped shape;

at least three pairs of first and second external electrodes formed on two longer sides, the first and second external electrodes in each of the pairs having different polarities and opposing each other, and the first and second external electrodes on each of the longer sides arranged alternately with each other; and

a plurality of first and second internal electrodes arranged alternately to interpose each of the dielectric layers, the first and second internal electrodes connected to the first and second external electrodes by leads, respectively,

wherein the capacitor body has a length that is at least 3 times and up to 7 times a width thereof.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 27, 2007
From: LEE, BYOUNG HWA; WI, SUNG KWON; CHUNG, HAE SUK; PARK, DONG SEOK; PARK, SANG SOO; PARK, MIN CHEOL
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 020345/0462 →
Priority Claims (1)
KR 10-2007-0009913 · Jan 31, 2007 · national
Continuity (1)
Related Publication 20080180879A1 · Jul 31, 2008