IP Library › Assignment 020352/0626
Patent Assignment
Reel/Frame 020352/0626

Assignment of Assignor's Interest

Recorded: 2008-01-11 Pages: 4
Assignors
YANG, WEN-KUN
Executed: 2007-12-31
YANG, WEN-PIN
Executed: 2007-12-31
Assignee
ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
NO. 65, GUANGFU N. RD., HUKOU TOWNSHIP, HSINCHU COUNTY, 303, TAIWAN
Covered Property (1)
Structure of Image Sensor Module and Method for Manufacturing of Wafer Level Package
Patent: 7,501,310 →
Application: 11/945,723 →
Publication: US 2008/0108168
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Sep 15, 2023
From: ADL ENGINEERING INC.; ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
To: ADL ENGINEERING INC.
Reel/Frame 064926/0845 →
Change of Name Sep 15, 2023
From: ADL ENGINEERING INC.
To: ADL ENERGY CORP.
Reel/Frame 064927/0462 →
Assignment of Assignor's Interest Dec 27, 2023
From: ADL ENERGY CORP.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 065957/0661 →