Patent Assignment
Reel/Frame 020373/0373
Assignment of Assignor's Interest
Recorded: 2008-01-16
Pages: 2
Assignor
KONDO, DAIYU
Executed: 2007-11-01
Assignee
FUJITSU LIMITED
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU,, KAWASAKI-SHI, KANAGAWA, 211-8588, JAPAN
Covered Property
(1)
Bundle of Long Thin Carbon Structures, Manufacturing Method Thereof, and Electronic Device